Mega Sonic Cleaning Machine

Megasonic cleaning polishing wafer can remove particles less than 200nm on the surface of the wafer, with the particle removal effect unmatched by ultrasonic waves.

Specific application scenarios include:

1. wafer, liquid crystal and other micro-fine particle removal, cleaning accuracy can reach 200nm, the maximum cleaning 400mm * 400mm substrate;

2. cleaning and drying of optical components, such as: for the cleaning of optical glass such as lenses, prisms, microscopes, etc..

3. Optical glass cleaning touch screen, ITO glass, etc. before coating, before and after tempering and before polishing.

Product main technical parameters

Shenzhen Diao Tuo Technology Co., LTD

Contact person: Mike

Email address: nanofab@diaotuotech.com

Telephone: +8619820819249

Welcome to inquire!